Join PlaceTech at MIPIM PropTech NYC
MIPIM PropTech NYC will see 1,000 delegates gather from more than 35 countries at the Metropolitan Pavilion in New York City on 6 November.
PlaceTech has agreed a media partnership with MIPIM PropTech NYC. The global proptech event is co-hosted by MIPIM organiser Reed MIDEM and venture fund manager MetaProp NYC, and forms a central part of New York Real Estate Tech Week.
MIPIM PropTech is designed to bring key property decision-makers from all sectors together with technology companies to take their businesses to the next level and build the future of real estate. The first MIPIM PropTech took place in 2017, and the first European event took place this summer in Paris.
Paul Unger, editor and publisher of PlaceTech, said: “We are looking forward to hearing from companies at the front line of innovation in real estate at MIPIM PropTech NYC. We have a fantastic history of working with Reed MIDEM as a group, and are pleased to be building on our partnership of the European event in June. As well as providing coverage for readers we will be using the trip to promote PlaceTech’s property community platform and the work of our partners Mills & Reeve, Bruntwood and Manchester Science Partnerships, OBI and Redwood Consulting, to a global audience throughout the week in New York.”
Speakers in New York are due to include Arie Barendrecht, founder of WiredScore; Brad Greiwe, co-founder of Fifth Wall; proptech guru Duke Long; Nick Romito, CEO of VTS; and Jeff Stein, head of AECOM Ventures.
The event will also host the North American leg of the MIPIM Startup Competition, which will conclude at MIPIM in Cannes in 2019. The winners from the MIPIM PropTech Europe leg were Czech firm Spaceti and Sensorberg from Germany. Applications close on 7 October.
PlaceTech will be reporting from MIPIM PropTech NYC, as well as MIPIM UK in October and MIPIM in Cannes. Register free for the PlaceTech Weekly newsletter to keep updated.
Early bird tickets for the New York event are available for another 2 weeks.